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IKOR in European project PAMPA 2015

European project PAMPA has started in February 2015 for 24 months in the frame of the Horizon 2020 work program set up by the European Commission.

PAMPA-IKORhorizon2020-IKOR

 

In PAMPA,  which stands for “Plastic Components for Advanced  Microwave Equipment of Next Generation SatCom Payloads”, the objective is to develop a plastic technology for future low cost and highly reliable microwave equipment  of advanced telecom satellites.

The consortium gathered by Thales Alenia Space France includes IKOR Technology Centre in Spain for the board assembly, UMS (United Monolitic Semiconductors) in France and SENCIO in the Netherlands for the manufacturing of components in plastic packages and IMEC in Belgium for the reliability assessment.

The first prototypes of a plastic European technology with a quality grade compatible of Space needs will be developed for Monolithic Microwave Integrated Circuits (MMIC) and Application Specific Integrated Circuits (ASIC).

 A demonstrator exhibiting the potential of the technology for new microwave equipment of future telecom satellites will be manufactured. 

 

 

IKOR, 22 April 2015